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Winscon Electronics (Huizhou) Co., Ltd.
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Price: | 0.1~100.0 USD |
Payment Terms: | T/T,WU |
Place of Origin: | Guangdong, China (Mainland) |
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PCB Producing Capability | |||||
No. | Item | Producting Capability | |||
1 | Layers | 2-8 | |||
2 | PCB thickness | Max.:3.5mm | |||
Min.:0.2MM | |||||
3 | Panel Size | Max.:> 540MM | |||
Min.:>100mm | |||||
Max.18"*24" | |||||
4 | Drilling | Min.:0.25mm | |||
Max.:6.35mm | |||||
5 | Immersion Copper | Max. 25.4UM 5:1(max) | |||
6 | dry film hole sealing capacity | Max.Hole(5.0MM) slot(5.0*3.0MM) | |||
7 | Etching Tolerance | Min.:±20% or ±1mil | |||
8 | Line | Line width Min.:4MIL | |||
Line space Min.:4MIL | |||||
9 | Electroplating | copper thickness of PTH | 12UM(min),25.4(max) | ||
electroplating Au | Ni | 100U" | |||
Au | 0.6-1.5U" | ||||
Immersion Au | Ni | 100-250U" | |||
Au | 1-3U" | ||||
Immersion Ag | 8-10U" | ||||
Immersion Pb | 0.8-1.0UM | ||||
electroplating Pin | Ni | 100U" | |||
Au | 2-10U" | ||||
10 | solder resist | Width | Min.:4MIL | ||
Space | 3MIL | ||||
Hole | Max.0.5MM | ||||
11 | Character | Min.:5MIL | |||
12 | Outline Tolerance | Min.:±5MIL(0.13MM) | |||
13 | Surface finish | HASL, Immersion Silver/Gold/Tin OSP, Plating Gold |